Cutting elements with re-processed thermally stable polycrystalline diamond cutting layers, bits incorporating the same, and methods of making the same
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United States of America Patent
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Nov 26, 2013
Grant Date -
Nov 11, 2010
app pub date -
May 6, 2010
filing date -
May 6, 2009
priority date (Note) -
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Abstract
A method of re-processing used TSP material layers to form cutting elements, bits with such cutting elements mounted on their bodies, and bits having re-processed TSP material layers attached to their bodies, as well as such cutting elements and bits are provided. The method includes providing a used TSP material cutting element having a TSP material layer and substrate, or a bit having a TSP material layer attached to the bit, removing the used TSP material layer from the cutting element or bit, cutting the used TSP material layer to a new shape, if necessary, optionally re-leaching the used TSP layer and re-using the TSP material layer to form a cutting element, or in forming a bit body. The formed cutting element may be mounted on a bit body.
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