Circumferential full thickness resectioning device
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United States of America Patent
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Nov 26, 2013
Grant Date -
Jul 7, 2005
app pub date -
Dec 24, 2003
filing date -
Dec 24, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
An apparatus for performing endoluminal anastomosis of an organ comprises an operative head including an endoscope receiving lumen for slidably receiving a flexible endoscope therein, the operative head including an annular tissue receiving space extending around a circumference of a distal end thereof and a stapling mechanism for firing staples around an entire circumference of the tissue receiving space and a tissue gripping mechanism for drawing into the tissue receiving space a portion of tissue extending around an entire circumference of the organ.
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