Sputtering system and method for depositing thin film
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United States of America Patent
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Nov 26, 2013
Grant Date -
Jan 14, 2010
app pub date -
Mar 28, 2006
filing date -
Mar 28, 2006
priority date (Note) -
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Abstract
A sputtering system for depositing a thin film on the surface of a disc substrate in which high precision positioning of an inner mask and an outer mask is facilitated. The sputtering system has a mask member placed on the surface of the substrate mounted on a substrate holder to cover a partial region on the surface of the substrate. A thin film is deposited by sputtering in a region on the surface of the substrate not covered by the mask member. A section for carrying in and carrying out the substrate has mechanically holds and releases the substrate holder mounting the substrate, and mechanically holds and releases the mask member.
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