LED unit
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United States of America Patent
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Nov 26, 2013
Grant Date -
Feb 9, 2012
app pub date -
Apr 13, 2010
filing date -
Apr 13, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
The LED unit 100 comprises a plurality of the LED module 1 and the heat radiation plate. Each the LED module 1 comprises the LED chip and the package for incorporating the LED chip therein; the package has the electrical insulation property. Each the package comprises the sub-mount member which is located between the LED chip and the heat radiation plate and which has heat conductivity; these are integrally formed. The LED modules are arranged on the first surface of the heat radiation plate. This configuration makes it possible for the LED unit to efficiently disperse the heat in the LED chip 10 to the heat radiation plate.
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