Controlled-impedance electronic board vias, method of forming the same, and unitized PCB incorporating the same
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United States of America Patent
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Dec 3, 2013
Grant Date -
Oct 6, 2011
app pub date -
Jan 28, 2011
filing date -
Mar 31, 2010
priority date (Note) -
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Abstract
A shielded signal pass-through or via structure integral with an electronic circuit board is described. The structure includes a rigid inner generally cylindrical conductor; at least a semi-rigid intermediate annular dielectric surrounding the conductor; and a rigid outer annular conductor surrounding the dielectric material. Also described is an interconnect device that presents a contact array in a boss region of a unitary embossed printed circuit board (PCB) optionally equipped with one or more such shielded vias.
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