Method and device for determining a deformation of a disk-shaped workpiece, particularly a mold wafer
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United States of America Patent
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Dec 3, 2013
Grant Date -
Sep 20, 2012
app pub date -
Feb 17, 2012
filing date -
Aug 19, 2009
priority date (Note) -
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Abstract
The present invention relates to a method and a device for determining a deformation of a disc-shaped workpiece, in particular a mold wafer. The device comprises a rotatable, height and laterally adjustable mounting unit for mounting an inner region of the disc-shaped workpiece; a determination unit for determining eccentricity of a center axis of the disc-shaped workpiece from a center axis of the mounting unit and for generating a suitable adjustment signal for the mounting unit; a deposit unit for depositing the disc-shaped workpiece during a process of lateral adjustment of the mounting unit; and a fixed-height detector unit for measuring a deviation of a plurality of measuring points, respectively, in a non-mounted outer region of the disc-shaped workpiece from a predetermined height position corresponding to the deformation by rotating the mounting unit or the detector unit at a predetermined height position of the mounting unit.
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