Binding device

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United States of America Patent

PATENT NO 8602672
APP PUB NO 20100034576A1
SERIAL NO

12524721

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Abstract

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A binding device is provided which allows reduction in profile.

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Patent Owner(s)

Patent OwnerAddress
LIHIT LAB INC1-22 NONINBASHI 1-CHOME CHUO-KU OSAKA-SHI OSAKA 540-8526

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Hiroshi Kawachinagano, JP 137 1407
Kanaka, Kanji Ashiya, JP 1 0
Nakano, Hiroshi Ibaraki, JP 377 4094

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