Method of manufacturing a connector chip
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United States of America Patent
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Dec 17, 2013
Grant Date -
Oct 21, 2010
app pub date -
Jun 30, 2010
filing date -
Nov 12, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacturing a connector chip includes preparing a plate-like insulating substrate material with a plurality of through hole rows arranged therein; forming a plurality of first and second base layers on opposite surfaces of the insulating substrate material; forming insulating layers between each two adjoining first base layers and between each two adjoining second base layers; forming third base layers on the one side over edge portions of the first base layers, internal surfaces of the through holes, and edge portions of the second base layers; forming fourth base layers on the other side over edge portions of the first base layers, the internal surfaces of the through holes, and edge portions of the second base layers; cutting the insulating substrate material along a middle of each of the through hole rows; and forming one or more plated layers over the first to fourth base layers.
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