Package interface plate for package isolation structures

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8614491
APP PUB NO 20100252899A1
SERIAL NO

12749687

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Abstract

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A package assembly comprises a package base, a sensor die, an isolation plate, and a package interface plate. The isolation plate is bonded to the sensor die and has a plurality of flexible beams. Each flexible beam is configured to deflect under stress such that effects on the sensor die of a thermal mismatch between the package base and the sensor die are reduced. The package interface plate is bonded to the isolation plate and the package base. The package interface plate is configured to limit the maximum distance each flexible beam is able to deflect.

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Patent Owner(s)

  • HONEYWELL INTERNATIONAL INC.;MOTOROLA, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Glenn, Max C Chanhassen, US 30 564

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