Ruggedized waveguide encapsulation fixture for receiving a compressed waveguide component

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United States of America Patent

PATENT NO 8614610
APP PUB NO 20120057839A1
SERIAL NO

12877059

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Abstract

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A waveguide component encapsulation device may include a housing having first and second surfaces, the housing defining a channel extending through the first and second surfaces, a micromachined waveguide component configured to be positioned in the channel, the waveguide component having first and second ends extending outside the channel and beyond the first and second surfaces of the housing by a finite length, and a pair of spacing members configured to align and stabilize the waveguide component within the channel.

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Patent Owner(s)

  • TELEDYNE SCIENTIFIC & IMAGING, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Borwick,, III Robert L Thousand Oaks, US 16 232
Field, Mark Campbell, US 6 8
Hacker, Jonathan Thousand Oaks, US 3 49
Hillman, Chris Newbury Park, US 14 157

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