Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
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United States of America Patent
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Dec 31, 2013
Grant Date -
Mar 18, 2010
app pub date -
Sep 12, 2008
filing date -
Sep 12, 2008
priority date (Note) -
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Abstract
The present invention is a thermal spreader for providing a high effective thermal conductivity between a heat source and a heat sink. The thermal spreader may include a mechanically flexible substrate. The mechanically flexible substrate may be at least partially constructed of organic materials. The mechanically flexible substrate may form an internal channel which is configured for containing an electrically-conductive liquid. The thermal spreader may further include a pump. The pump may be configured for being connected to the substrate and for circulating the electrically-conductive liquid within the internal channel. The thermal spreader may further include one or more thermally-conductive, rigid metal inserts. Each insert may be configured for being in thermal contact with the electrically-conductive liquid and the substrate and for promoting heat transfer between the thermal spreader and the electrically-conductive liquid.
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