Thin semiconductor die package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8618675
APP PUB NO 20130105999A1
SERIAL NO

13281734

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor die is attached to a substrate by a glass frit layer. Gas that might be trapped between the die and the glass frit layer during firing of the glass frit can escape through passages that are formed against the bottom surface of the die by topographies that extend away from and which are substantially orthogonal to the bottom of the die.

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Patent Owner(s)

  • CONTINENTAL AUTOMOTIVE SYSTEMS, INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ding, Xiaoyi Lake Zurich, US 18 434
Frye, Jeffrey James Grayslake, US 1 5

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