Probe-card interposer constructed using hexagonal modules
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United States of America Patent
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Jan 7, 2014
Grant Date -
Oct 18, 2012
app pub date -
Apr 13, 2011
filing date -
Apr 13, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Apparatus and methods for fabricating an interposer that may be used in testing a large number of electronic circuits or devices in parallel. The interposer may be fabricated from a plurality of modules that may be assembled into a selected shape, such that the assembled modules substantially fill the selected shape, e.g., a circle approximately the size of a semiconductor wafer. The plurality of modules may be formed from a single base shape (e.g., formed from a single injection mold). A portion of the formed modules may be machined into a first machined shape, or first and second machined shapes. The assembled modules may include only the base shape and first machined shape or first and second machined shapes. The limited number of shapes can reduce fabrication costs for an interposer.
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