Method and device for treating silicon wafers

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United States of America Patent

PATENT NO 8623232
APP PUB NO 20100311247A1
SERIAL NO

12818853

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Abstract

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A method and device for treating silicon wafers. In a first step, the silicon wafers (22) are conveyed flat along a continuous, horizontal conveyor belt (12, 32) and nozzles (20) or the like spray an etching solution (21) from the top onto the wafers to texture them, only little etching solution (21) being applied to the silicon wafers (22) from below. In a second step, the silicon wafers (22), which are aligned as in the first step, are wetted exclusively from below with the etching solution (35) to etch-polish them.

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Patent Owner(s)

Patent OwnerAddress
GEBR SCHMID GMBH & COROBERT-BOSCH-STRASSE 32-34 FREUDENSTADT 72250

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kappler, Heinz Dornstetten-Aach, DE 9 24

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