Wetting agent for semiconductors, and polishing composition and polishing method employing it

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United States of America Patent

PATENT NO 8632693
APP PUB NO 20100003821A1
SERIAL NO

12496314

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Abstract

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To provide a wetting agent for semiconductors and a polishing composition whereby the wettability of a semiconductor substrate surface can be improved, and microdefects such as particle attachments can be remarkably reduced.

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Patent Owner(s)

  • FUJIMI INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ide, Shogaku Kiyosu, JP 6 14
Imao, Tomohiro Kiyosu, JP 2 15
Ishihara, Naoyuki Kiyosu, JP 17 185
Morinaga, Hitoshi Kiyosu, JP 64 501
Takahashi, Shuhei Kiyosu, JP 60 301

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