Package for an electronic device
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United States of America Patent
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Jan 28, 2014
Grant Date -
N/A
app pub date -
Feb 20, 2012
filing date -
Jan 15, 2008
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming a device is provided. A substrate having a component is provided and a sacrificial layer is formed over the component. The sacrificial layer includes a cavity portion disposed about the component and a tunnel portion adjacent to the cavity portion. In addition, an encapsulation layer having a cover portion and a perimeter portion is formed over the sacrificial layer. The cover portion encapsulates the cavity portion such that the cavity portion forms a cavity within the cover portion. The perimeter portion is disposed over the tunnel portion. Moreover, an access hole is formed in the perimeter portion of the encapsulation layer.
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