Device including a semiconductor chip and a carrier and fabrication method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8637379
APP PUB NO 20110084369A1
SERIAL NO

12575532

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Abstract

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A description is given of a method. In one embodiment the method includes providing a semiconductor chip with semiconductor material being exposed at a first surface of the semiconductor chip. The semiconductor chip is placed over a carrier with the first surface facing the carrier. An electrically conductive material is arranged between the semiconductor chip and the carrier. Heat is applied to attach the semiconductor chip to the carrier.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eder, Hannes Villach, AT 8 499
Goerlich, Jens Bueren, DE 3 28
Guth, Karsten Soest, DE 19 110
Heinrich, Alexander Regensburg, DE 88 264
Nikitin, Ivan Regensburg, DE 75 455
Schneegans, Manfred Vaterstetten, DE 57 278

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