Anti-tamper wrapper interconnect method and a device
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United States of America Patent
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Jan 28, 2014
Grant Date -
Aug 16, 2012
app pub date -
Feb 10, 2012
filing date -
Feb 16, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A method for electrically coupling an anti-tamper mesh to an electronic module or device using wire bonding equipment and a device made from the method. Stud bumps or free air ball bonds are electrically coupled to conductive mesh pads of an anti-tamper mesh. Respective module pads have a conductive epoxy disposed thereon for the receiving of the stud bumps or free air ball bonds, each of which are aligned and bonded together to electrically couple the anti-tamper mesh to predetermined module pads.
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