Laminated chip electronic component, board for mounting the same, and packing unit thereof
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United States of America Patent
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Jun 4, 2013
Grant Date -
Dec 5, 2013
app pub date -
Aug 17, 2012
filing date -
May 30, 2012
priority date (Note) -
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Abstract
A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; first and second external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer; and additional electrode layers disposed irrespective of a formation of capacitance within the lower cover layer.
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