Device for placing material on or beneath the soil surface
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United States of America Patent
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Feb 4, 2014
Grant Date -
Aug 25, 2011
app pub date -
Feb 23, 2011
filing date -
Feb 23, 2010
priority date (Note) -
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Abstract
A device for treating soil includes a soil contact head having at least one discharge orifice therein, a handle attached to the soil contact head, a discharge valve in fluid communication with the at least one discharge orifice, a soil contact indicator, and a source of pressurized soil treatment fluid flowably connected to the discharge valve. The discharge valve discharges the pressurized soil treatment fluid through the at least one discharge orifice when the soil contact indicator indicates contact between the soil contact head and the soil.
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