Polishing composition for planarizing metal layer

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United States of America Patent

PATENT NO 8641920
APP PUB NO 20100163784A1
SERIAL NO

12482983

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Abstract

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A polishing composition of the present invention at least comprises about 750 ppm to less than 5000 ppm by weight of abrasive particles, hydrogen peroxide, an accelerator, a dual-corrosion inhibitor and water, wherein the dual-corrosion inhibitor contains a first and a second corrosion inhibitor. The dual-corrosion inhibitor is applied to the planarization of metal layers so as to maintain a high removal rate of metal layers as well as suppress etching of the metal, thus capable of reducing polishing defects such as dishing, erosion and the like.

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Patent Owner(s)

Patent OwnerAddress
FERRO CORPORATION6060 PARKLAND BOULEVARD SUITE 250 MAYFIELD HEIGHTS OH 44124

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Song-Yuan Zhongli, TW 17 105
Ho, Ming-Che Zhongli, TW 132 1332
Lu, Ming-hui Zhongli, TW 10 36

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