Surface mount bias tee
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United States of America Patent
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-
Feb 4, 2014
Grant Date -
N/A
app pub date -
Jul 28, 2011
filing date -
Jul 28, 2011
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A miniaturized wideband surface mount bias tee comprises a printed circuit board with a functioning first capacitor and a dummy second capacitor, and an inductor bonded atop the two capacitors. The capacitors, adhesive and solder are depositable by standard surface mount pick and place machinery. The inductor wires are bonded to one of the first capacitor bonding pads and to an inductor bonding pad. The circuit element bonding pads include portions bordering the pc board edges and are conductively connected to bonding pads on the bottom face of the pc board. Conductive thru-vias for the first capacitor bonding pads reduce parasitic inductance and extend the operating frequency range. A flat-topped insulating cap encloses the bias tee sides and top. The cap forms an air gap between the inductor and circuit elements and provides a surface for manipulating the bias tee with present-day assembly equipment.
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Cited Art Landscape
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