Method for polishing a semiconductor wafer
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United States of America Patent
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Feb 11, 2014
Grant Date -
Jul 25, 2013
app pub date -
Mar 11, 2013
filing date -
Oct 28, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A method of polishing a semiconductor wafer using a holding system including a lined cutout the size of the semiconductor wafer that is fixed to a carrier. The method includes holding the semiconductor wafer in the cutout through adhesion of a first side of the semiconductor wafer to a bearing surface in the cutout and polishing a second side of the held semiconductor wafer using a polishing pad that is fixed on a polishing plate while introducing a polishing agent between the second side of the semiconductor wafer and the polishing pad, the polishing pad including fixedly bonded abrasive materials. The carrier is guided during polishing such that a portion of the second side of the semiconductor wafer temporarily projects beyond a lateral edge of a surface of the polishing pad.
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