Polishing composition and polishing method using the same

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United States of America Patent

PATENT NO 8647527
APP PUB NO 20080173843A1
SERIAL NO

12018672

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Abstract

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A polishing composition contains a vanadate such as ammonium vanadate, sodium vanadate, and potassium vanadate and an oxygen donor such as hydrogen peroxide and ozone. It is preferable that the polishing composition further contains at least either one of abrasive grains and a pH adjusting agent. The polishing composition can be suitably used for polishing a silicon carbide wafer such as a hexagonal silicon carbide single crystal wafer.

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Patent Owner(s)

  • FUJIMI INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hotta, Kazutoshi Ichinomiya, JP 6 31
Kawata, Kanji Inuyama, JP 1 1

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