Method of manufacturing glass substrate and method of manufacturing electronic components
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United States of America Patent
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Feb 25, 2014
Grant Date -
Jan 12, 2012
app pub date -
Jul 7, 2011
filing date -
Jul 8, 2010
priority date (Note) -
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Abstract
A method of manufacturing a glass substrate with buried through electrodes comprises forming via-holes in each of two base panels and in a glass panel interposed between the base panels so that the via-holes are aligned with one another. Conductive wires are penetrated through the aligned via-holes and stretched between the base panels. The first panel is subjected to compression stress and is heated to a temperature higher than a softening point of the glass material so that the stretched conductive wires are buried in the glass material. The first panel is then cooled to form a glass ingot having the buried conductive wires. The glass ingot is sliced to form a glass panel, and the glass panel is polished to expose the buried conductive wires on front and rear surfaces of the glass panel to form a glass substrate with buried through electrodes.
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