Implant delivery apparatus and methods with electrolytic release

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United States of America Patent

PATENT NO 8657870
APP PUB NO 20100331948A1
SERIAL NO

12492770

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Abstract

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Implant release apparatus includes a connector connecting a lead having an electrolytically erodible portion and a restraint that restrains the implant. In one embodiment, the connector can include or comprise a nonconductive member.

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Patent Owner(s)

  • BIOSENSORS INTERNATIONAL GROUP, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Davis, Matthew L Danville, US 1 18
Ngo, Thuan Milpitas, US 1 76
Turovskiy, Roman San Francisco, US 79 6962

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