Light emitting diode packaging structure
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United States of America Patent
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Feb 25, 2014
Grant Date -
Oct 4, 2012
app pub date -
Jun 13, 2012
filing date -
Jan 1, 2010
priority date (Note) -
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Abstract
The present invention discloses an LED packaging structure, which comprises a metal housing having a cavity and two open ends, a sintered two-phase-flow heat transfer device having a flat top mounting plane, a lens disposed in the first open end, at least one LED chip mounted in the cavity of the metal housing and on the mounting plane of the two-phase-flow heat transfer device; the LED chip is connected with an electrical connection device, and wherein the sintered two-phase-flow, electrical connection device and LED chip are fixed together through a fixing base. Using a sintered two-phase-flow heat transfer device for heat dissipation, the heat generated by the LED could be expelled in time for dealing with long-term continual work, and thus the LED chip could have a longer service life. In addition, the lens used in the present invention could improve the luminescent efficiency.
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