Microelectronic package with terminals on dielectric mass

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United States of America Patent

PATENT NO 8659164
APP PUB NO 20130032387A1
SERIAL NO

13648495

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Abstract

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A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably connect the top terminals to bottom terminals on the package substrate. The dielectric mass can be formed, for example, by molding or by application of a conformal layer.

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Patent Owner(s)

Patent OwnerAddress
TESSERA INC3099 ORCHARD DRIVE SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Haba, Belgacem Saratoga, US 769 23924

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