Integrated circuit tampering protection and reverse engineering prevention coatings and methods
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United States of America Patent
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Mar 4, 2014
Issued Date -
N/A
app pub date -
Dec 16, 2011
filing date -
Aug 23, 2006
priority date (Note) -
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Abstract
A method of protecting an electronics package is discussed along with devices formed by the method. The method involves providing at least one electronic component that requires protecting from tampering and/or reverse engineering. Further, the method includes mixing into a liquid glass material at least one of high durability micro-particles or high-durability nano-particles, to form a coating material. Further still, the method includes depositing the coating material onto the electronic component and curing the coating material deposited.
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