Method for applying liquid material, application device and program
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United States of America Patent
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Apr 22, 2014
Grant Date -
Dec 13, 2012
app pub date -
Aug 6, 2010
filing date -
Aug 6, 2010
priority date (Note) -
Withdrawn
status (Latency Note)
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Abstract
Disclosed are an application method, device and program which enable the constant retention of a fillet shape, without altering the shape due to the speed differences associated with changes in the direction of the nozzle or differences in the degree of penetration when bumps are arranged non-uniformly. In a liquid material application method a desired application pattern is created, liquid material is discharged from a nozzle whilst the nozzle and a workpiece are moved relative to one another, and the gap between a substrate and the workpiece, the workpiece being placed above the substrate by means of at least three bumps, is filled up with liquid material by capillary action. If bumps are arranged non-uniformly, the supply quantity per unit area of the application pattern is set so that a greater quantity is supplied to application areas next to areas where the integration density of bumps is high, than is supplied to application areas next to areas where the integration density of bumps is low.
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