Through-wafer interconnects for photoimager and memory wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8669179
SERIAL NO

13940034

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • ROUND ROCK RESEARCH, LLC

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, US 801 30711
Farnworth, Warren M Nampa, US 855 33437
Hembree, David R Boise, US 392 15671
Hiatt, William M Eagle, US 129 4699
Kirby, Kyle K Eagle, US 237 5422
Oliver, Steven D San Jose, US 24 928
Rigg, Sidney B Meridian, US 35 1195
Tuttle, Mark E Boise, US 288 10539
Velicky, Lu Boise, US 6 324
Wark, James M Boise, US 182 5720
Watkins, Charles M Eagle, US 129 1921
Wood, Alan G Boise, US 415 23092

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Sep 11, 2025
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00