Through-wafer interconnects for photoimager and memory wafers

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United States of America Patent

PATENT NO 8669179
SERIAL NO

13940034

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Abstract

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A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

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Patent Owner(s)

  • ROUND ROCK RESEARCH, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akram, Salman Boise, US 801 30704
Farnworth, Warren M Nampa, US 855 33423
Hembree, David R Boise, US 392 15665
Hiatt, William M Eagle, US 129 4696
Kirby, Kyle K Eagle, US 236 5411
Oliver, Steven D San Jose, US 24 928
Rigg, Sidney B Meridian, US 35 1195
Tuttle, Mark E Boise, US 288 10536
Velicky, Lu Boise, US 6 324
Wark, James M Boise, US 182 5716
Watkins, Charles M Eagle, US 129 1920
Wood, Alan G Boise, US 415 23084

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