Lead component and method for manufacturing the same, and semiconductor package
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United States of America Patent
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Mar 11, 2014
Issued Date -
N/A
app pub date -
Mar 15, 2012
filing date -
Mar 29, 2011
priority date (Note) -
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Abstract
To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.
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