Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same
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United States of America Patent
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Mar 18, 2014
Grant Date -
Jul 12, 2012
app pub date -
Aug 27, 2010
filing date -
Aug 27, 2010
priority date (Note) -
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Abstract
A silver nanoparticle composition is provided which is possible to be sintered through sintering at a low temperature in a short time and to form silver electro conductive film and wiring which is favorable for adhesion to a substrate and low in resistance, and articles using the same are provided. The silver nanoparticle composition is provided, wherein a main component of a solvent is water, a pH of the composition is within a range of 5.3 to 8.0, a silver nanoparticle included in the composition is protected by an organic acid or a derivative thereof, and the content of the organic acid or the derivative thereof with respect to silver is 2 to 20% by mass.
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