Light-emitting device package and method of manufacturing the same
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United States of America Patent
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Mar 18, 2014
Grant Date -
Oct 31, 2013
app pub date -
Jul 3, 2013
filing date -
Dec 24, 2010
priority date (Note) -
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Abstract
Provided are a light-emitting device package and a method of manufacturing the same. The light-emitting device package may include a plurality of light-emitting chips on one substrate (board). The plurality of light-emitting chips may produce colors around a target color. The target color may be produced by combinations of the colors of light emitted from the plurality of light-emitting chips. The colors around the target color may have the same hue as the target color and have color temperatures different from that of the target color. The plurality of light-emitting chips may have color temperatures within about ±250K of that of the target color.
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