Ear-muff type headset for two-way communication
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United States of America Patent
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Mar 18, 2014
Grant Date -
Jul 14, 2011
app pub date -
Sep 2, 2009
filing date -
Sep 4, 2008
priority date (Note) -
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Abstract
It is an object of the invention to provide a headset for performing simultaneous two-way communication or alternate two-way communication, which has excellent sound insulating properties such that external noise is not possibly mixed even when used under high noise conditions. A pair of bowl-shaped housings 1 each having an annular pad 2 attached to the rim of an opening portion are connected together through a headband 3, an acoustic speaker 5 supported by a buffer material 4 is arranged in at least one of the housings 1, and a bone conduction microphone 6 supported by the buffer material 4 such that the distal end is brought into abutment against the ear or the portion around the ear when a user wears the headset is arranged in at least one of the housings 1.
First Claim
Family
- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
| Patent Owner | Address | |
|---|---|---|
| TEMCO JAPAN CO LTD | 12-26 HOUNAN 2-CHOME SUGINAMI-KU TOKYO JAPAN TOKYO |
International Classification(s)
Inventor(s)
| Inventor Name | Address | # of filed Patents | Total Citations |
|---|---|---|---|
| Atsumi, Tomoya | Tokyo, JP | 4 | 260 |
| Fujino, Shouji | Tokyo, JP | 8 | 88 |
| Fukuda, Mikio | Tokyo, JP | 31 | 1011 |
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|---|
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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