Ear-muff type headset for two-way communication

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8675897
APP PUB NO 20110170718A1
SERIAL NO

12996444

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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It is an object of the invention to provide a headset for performing simultaneous two-way communication or alternate two-way communication, which has excellent sound insulating properties such that external noise is not possibly mixed even when used under high noise conditions. A pair of bowl-shaped housings 1 each having an annular pad 2 attached to the rim of an opening portion are connected together through a headband 3, an acoustic speaker 5 supported by a buffer material 4 is arranged in at least one of the housings 1, and a bone conduction microphone 6 supported by the buffer material 4 such that the distal end is brought into abutment against the ear or the portion around the ear when a user wears the headset is arranged in at least one of the housings 1.

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Patent Owner(s)

Patent OwnerAddress
TEMCO JAPAN CO LTD12-26 HOUNAN 2-CHOME SUGINAMI-KU TOKYO JAPAN TOKYO

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Atsumi, Tomoya Tokyo, JP 4 260
Fujino, Shouji Tokyo, JP 8 88
Fukuda, Mikio Tokyo, JP 31 1011

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