Flow sensing device and packaging thereof
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United States of America Patent
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Mar 25, 2014
Grant Date -
Jun 28, 2012
app pub date -
Mar 10, 2010
filing date -
Mar 10, 2009
priority date (Note) -
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Abstract
There is described a flow sensing device having a semiconductor chip with a flow channel integrated therein and a sensing element positioned in the flow channel, and a package base attached to the semiconductor chip and allowing access to the two passage-openings of the flow channel from opposite sides of the package base.
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