Method and apparatus for separating protective tape
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United States of America Patent
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Mar 25, 2014
Issued Date -
N/A
app pub date -
Oct 17, 2011
filing date -
Oct 19, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A first holding table suction-holds an annular projection of a wafer remaining on a rear face thereof for surrounding a back grinding region. A second holding table having an outer peripheral wall adjacent to an inner wall of the annular projection is inserted into a flat portion inside the annular projection for joining a separating adhesive tape to a protective tape on a surface of the wafer while a flat plane of the flat portion is suction-held. Thereafter, the adhesive tape is separated. Accordingly, the adhesive tape is separated from the surface of the wafer together with the protective tape.
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