Multipath soldered thermal interface between a chip and its heat sink
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United States of America Patent
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Mar 25, 2014
Grant Date -
Jan 12, 2012
app pub date -
Sep 7, 2011
filing date -
Aug 10, 2006
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Abstract
A Thermal Interface Material (“TIM”) composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process.
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