Integrated circuit packaging system with heat conduction and method of manufacture thereof
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United States of America Patent
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Mar 25, 2014
Grant Date -
Jun 20, 2013
app pub date -
Dec 14, 2011
filing date -
Dec 14, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; mounting a lid base over the substrate, the lid base having a base indentation and a hole with the integrated circuit within the hole; and mounting a heat slug over the lid base, the heat slug having a slug non-horizontal side partially within the base indentation.
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