Prevention and control of intermetallic alloy inclusions

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United States of America Patent

PATENT NO 8679964
APP PUB NO 20080293243A1
SERIAL NO

12173803

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Abstract

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In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions, can be achieved through a reaction preventive or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P).

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, Sung Kwon Chappaqua, US 44 870
Shih, Da-Yuan Poughkeepsie, US 185 11160
Son, Yoon-Chul Daejon, KR 26 194

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