Microdisplay packaging system
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United States of America Patent
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Mar 25, 2014
Grant Date -
Feb 9, 2012
app pub date -
Oct 13, 2011
filing date -
Dec 31, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Some embodiments provide a microdisplay integrated circuit (IC), a substantially transparent protective cover coupled to the microdisplay IC, and a base coupled to the microdisplay IC. Thermal expansion characteristics of the base may be substantially similar to thermal expansion characteristics of the protective cover. According to some embodiments, at least one set of imaging elements is fabricated on an upper surface of a semiconductor substrate, and a base is affixed to a lower surface of the semiconductor substrate to generate substantially negligible mechanical stress between the semiconductor substrate and the base.
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