Brace for bond wire

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United States of America Patent

PATENT NO 8680660
SERIAL NO

13798052

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Abstract

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In a semiconductor device having multiple tiers of bond wires extending in a first direction, dummy insulated bond wires extend in a second direction orthogonal to the first direction and between the wire tiers to support the wires in an upper tier to prevent them from sagging and contacting wires in a lower tier.

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Patent Owner(s)

  • NXP USA, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Law, Lai Cheng Cheras, MY 6 19
Wong, Boh Kid Ipoh, MY 4 14
Yap, Weng Foong Phoenix, US 16 136

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