Electronic component, electronic module, and method for manufacturing the same
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United States of America Patent
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Mar 25, 2014
Grant Date -
Apr 4, 2013
app pub date -
Sep 27, 2012
filing date -
Sep 30, 2011
priority date (Note) -
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Abstract
An electronic component includes a unit including an electronic device; and an opposite member opposing the electronic device, wherein the unit and the opposite member are bonded together with an adhering member disposed between the unit and the opposite member and having light-cured resin and inorganic particles dispersed in the light-cured resin; and wherein in a particle-diameter distribution of the inorganic particles by volume, a particle diameter having a cumulative value of distribution of 50 is 0.5 μm or more, and a particle diameter having a cumulative value of distribution of 90% is 5.0 μm or less.
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