Structures and methods for improving solder bump connections in semiconductor devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 25, 2014
Issued Date -
N/A
app pub date -
Oct 20, 2010
filing date -
Dec 29, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The method includes forming a plurality of trenches in a dielectric layer extending to an underlying metal layer. The method further includes depositing metal in the plurality of trenches to form discrete metal line islands in contact with the underlying metal layer. The method also includes forming a solder bump in electrical connection to the plurality of metal line islands.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully