Mounting structure of circuit board having multi-layered ceramic capacitor thereon
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United States of America Patent
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Mar 25, 2014
Grant Date -
Feb 28, 2013
app pub date -
Aug 21, 2012
filing date -
Aug 22, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed herein is a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, the multi-layered ceramic capacitor including dielectric sheets laminated thereon and external terminal electrodes formed at both ends thereof, the dielectric sheets having internal electrodes formed thereon, and the external terminal electrodes being connected in parallel with the internal electrode, wherein the internal electrodes are disposed to be in parallel with the circuit board, the external terminal electrodes are bonded to lands of the circuit board by a conductive material, and a bonding height (Ts) of the conductive material is lower than a sum of a gap (Ta) between the circuit board and a bottom surface of the multi-layered ceramic capacitor and a thickness (Tc) of a cover layer on a lower portion of the multi-layered ceramic capacitor, whereby vibration noise can be greatly reduced.
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