Printed circuit board
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United States of America Patent
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-
Mar 25, 2014
Issued Date -
N/A
app pub date -
Aug 19, 2009
filing date -
Aug 21, 2008
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A printed circuit board has a first solder land, a second solder land, and a signal line pattern. The first solder land is configured to be soldered with an electronic part. The second solder land is configured to accumulate solder, the second solder land being disposed on a downstream side of the first solder land as viewed in a direction in which the printed circuit is carried. The signal line pattern includes an exposed part that is not covered with a resist, the exposed part being disposed between the solder land and the solder bridge prevention land.
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Cited Art Landscape
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