Semiconductor chip stacking for redundancy and yield improvement
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United States of America Patent
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Apr 1, 2014
Grant Date -
Dec 27, 2012
app pub date -
Sep 8, 2012
filing date -
Mar 4, 2008
priority date (Note) -
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Abstract
A stacked semiconductor chip comprising multiple unit chips contains multiple instances of a first chip component that have a low yield and are distributed among the multiple unit chips. An instance of the first chip component within a first unit chip is logically paired with at least another instance of the first chip component within at least another unit chip so that the combination of the multiple instances of the first chip component across the multiple unit chips constitute a functional block providing the functionality of a fully functional instance of the first chip component. The stacked semiconductor chip may include multiple instances of a second chip component having a high yield and distributed across the multiple unit chips. Multiple low yield components constitute a functional block providing an enhanced overall yield, while high yield components are utilized to their full potential functionality.
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