Pitch-aware multi-patterning lithography
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United States of America Patent
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Apr 1, 2014
Grant Date -
Mar 13, 2014
app pub date -
Sep 12, 2012
filing date -
Sep 12, 2012
priority date (Note) -
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Abstract
A method, system, and computer program product for improving printability of a design of an integrated circuit (IC) using pitch-aware coloring for multi-patterning lithography (MPL) are provided in the illustrative embodiments. A first shape is identified in a layout of the IC corresponding to the design as being apart by a first distance from a second shape. The first distance is a forbidden distance and at least equal to a minimum distance requirement of a lithography system. A determination is made that the first shape and the second shape are colored using a first color. The first shape is changed to a second color, such that even though the first distance is at least equal to the minimum distance requirement of the lithography system, the first and the second shapes are placed on different masks to print the design, thereby improving the printability of the design.
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