Method and system for manufacturing an electronic interface apparatus
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United States of America Patent
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Apr 8, 2014
Grant Date -
Jan 17, 2013
app pub date -
Sep 24, 2012
filing date -
Apr 24, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.
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